Copper pyrophosphate,the Cas No.is 10102-90-6.And the molecular formular is Cu₂O₇P₂. It is lightly green powder.
Pyrophosphate copper plating is a widely used electroplating copper process, the characteristics of this process are that the plating solution is relatively stable, the crystallization of the plating layer is finer, the dispersion ability and covering ability are better than acid copper plating, the cathode current flow efficiency is higher than that of cyanide copper plating, a thicker plating layer can be obtained, and there is no stimulation in the plating process No corrosive gas escapes, so ventilation equipment can be omitted, the plating solution is non-toxic, and has no corrosion to equipment, and is especially suitable for electroplating of printed circuits and zinc alloy die-castings.

Chemical name:Copper pyrophosphate
Molecular formula:Cu₂O₇P₂
Molecular weight:301.04
Melting point:1140 °C
Density:4.2 g/cm3
CAS NO.:10102-90-6
Appearance: Lightly green powder
Assay: 98%
Package:25kg/bag